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Clad Metal for Crystal Oscillator Lids
Backed by patents and rigorous qualification, the innovative five-layer lidding solution has been successfully deployed in volume production, securing strong endorsements from key accounts.
Technical data
| Product: | AgCu15/Cu/Ni/4J29/Ni, AgCu15/Ni/4J29/Ni, AgCu28/Cu/Ni/4J29/Ni, AgCu28/Ni/4J29/Ni | Strip Thickness: | 0.015–1.5 mm |
| Cladding Layer Thickness: | 0.001–70% of total thickness | Cladding Layer Width: | 1–100 mm |
| Cladding Layer Tolerance: | +20% to -10% of cladding layer thickness | Performance: | Customized |
Features & Benefits
Multi-Layer Clad Structure
Features a symmetric Ni/Cu/Ni stress buffer between AgCu15 and 4J29 to balance internal stresses.
Hermetic Sealing Integrity
Ensures void-free, high-reliability sealing for crystal oscillator packages under extreme temperature cycling.
Miniaturization Ready
Optimized for ultra-thin profiles and micro-scale dimensions required by modern compact crystal oscillators, suited for the trend toward flattening.
Cost Efficiency
Enables automated production while effectively reduces material waste and overall manufacturing costs.
Application
Suitable for Clad metal for crystal oscillator lids
