Materials for Lead Frame
Addressing critical packaging challenges, the custom lead frame solutions strike a strategic balance among high conductivity, dimensional accuracy, and thermal endurance. Designed with a matched CTE for silicon and ceramic interfaces, they deliver exceptional protection against oxidizing and corrosive environments.
Technical data
| Product: | Al/42 alloy, Al/Kovar, Al/C19400, Al/C1020, Cu/42 alloy, Cu/Kovar, AgCu/42 alloy, AgCu/Kovar, Al/Ti/Al | Strip Thickness: | 0.015–1.5 mm |
| Strip Width: | 3–100 mm | Cladding Layer Thickness: | 0.001–70% of total thickness |
| Cladding Layer Width: | 1–100 mm | Cladding Layer Tolerance: | +20% to -10% of cladding layer thickness |
| Performance: | Customized |
Features & Benefits
Precision Alignment
Solves positioning difficulties associated with traditional brazing preforms.
Automation Ready
Optimized for high-speed pick-and-place and automated assembly lines.
Superior Performance
Excellent electrical and thermal conductivity; outstanding heat and corrosion resistance.
Miniaturization Support
Meets stringent requirements for miniaturization of integrated circuits.
Process Efficiency
High hermeticity reduces process steps, saves Kovar material, and lowers energy consumption.
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